The aim of the project is to combine technology approaches and create a miniaturized, cost-efficient package for optical sensors, MEMS and emitting devices including integrated optical functional layers such as filters for the visible and infrared wavelength range based on a multilayer ceramic rewiring wafer in combination with the hermetic joining processes at low temperatures. 

The project is funded by VDI Berlin under the number 16ES0677; ES2TECH054.

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