This paper reports on the investigation of a low-temperature anodic bonding process with layers of a lithium-niobate-phosphate glass on chip level. The glass layers are deposited by means of rf sputtering. The applied glass is characterised by its high ion conductivity, enabling anodic bonding at room temperature. Results of the optimisation process concerning the intrinsic stress of the glass layers and the thermal exposure of the substrates through the deposition process are presented. The stoichiometry of the glass layers is verified through Rutherford backscattering spectroscopy (RBS). The bonding strength is measured by tensile tests. Microfabricated atomic vapour cells are used for hermeticity tests of the bonding by absorption measurements of the caesium D1 lin